• -5%

GIGABYTE X570S AORUS MASTER AM4 AMD X570 SATA 6Gb/s USB 3.0

02146
Valoración 

Admite procesadores AMD Ryzen™ 5000 Series/ Ryzen™ 4000 G Series/ Ryzen™ 3000 Series/ Ryzen™ 3000 G Series/ Ryzen™ 2000 Series/ Ryzen™ 2000 G Series

DDR4 sin búfer ECC/no ECC de dos canales, 4 DIMM

Active OC Tuner presenta cambio dinámico entre P.B.O. y configuración manual de OC

Solución de VRM digital de Infineon directa de 14+2 fases con etapa de potencia de 70 A

Solución térmica avanzada con Fins-Array II, Direct Touch Heatpipe II, M.2 Thermal Guard III y Thermal Backplate

WiFi Intel® 6E 802.11ax y BT 5.2

Quad NVMe PCIe 4.0/3.0 x4 M.2 ultrarrápido con protectores térmicos

LAN ultrarrápida Intel® 2.5GbE 

SuperSpeed USB 3.2 Gen 2x2 TYPE-C® ofrece velocidades de transferencia de hasta 20 Gb/s

Smart Fan 6 

RGB FUSION 2.0 

Q-Flash 

472.632 $
449.000 $ Descuento 5% Pagando Transferencia / Billetes
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Descripción
Model
Brand GIGABYTE
Model X570S AORUS MASTER
Supported CPU
CPU Socket Type  AM4
CPU Type Supports AMD Ryzen 5000 Series / 4000 G-Series / 3000 Series / 3000 G-Series / 2000 Series / 2000 G-Series Processors
Chipsets
Chipset  AMD X570
Memory
Number of Memory Slots 4x288pin (DDR4)
Memory Standard DDR4 5400(OC)/ 5200(OC) / 5000(OC) / 4866(OC) / 4600(OC)/ 4400(OC) / 4300(OC) / 4266(OC) / 4133(OC) / 4000(OC) / 3866(OC) / 3800(OC) / 3733(OC) / 3600(OC) / 3466(OC) / 3400(OC) / 3333(OC) / 3300(OC) / 3200 / 2933 / 2667 / 2400 / 2133 (AMD Ryzen 4000 G-Series processors)

DDR4 5200(OC) / 5000(OC) / 4866(OC) / 4600(OC)/ 4400(OC) / 4300(OC) / 4266(OC) / 4133(OC) / 4000(OC) / 3866(OC) / 3800(OC) / 3733(OC) / 3600(OC) / 3466(OC) / 3400(OC) / 3333(OC) / 3300(OC) / 3200 / 2933 / 2667 / 2400 / 2133 (AMD Ryzen 3000 Series processors)

DDR4 5100(OC) / 5000(OC) / 4866(OC) / 4600(OC)/ 4400(OC) / 4300(OC) / 4266(OC) / 4133(OC) / 4000(OC) / 3866(OC) / 3800(OC) / 3733(OC) / 3600(OC) / 3466(OC) / 3400(OC) / 3333(OC) / 3300(OC) / 3200 / 2933 / 2667 / 2400 / 2133 (AMD Ryzen 5000 Series processors)

DDR4 3600(OC) / 3466(OC) / 3400(OC) / 3333(OC) / 3300(OC) / 3200(OC) / 2933 / 2667 / 2400 / 2133 (AMD Ryzen 3000 G-Series Processors / AMD Ryzen 2000 Series Processors / AMD Ryzen 2000 G-Series Processors)
Maximum Memory Supported 128GB
Channel Supported  Dual Channel
ECC Supported Yes
Buffer Supported Un-buffered
Expansion Slots
PCI Express 4.0 x16 3 x PCI Express 4.0 x16*

* Actual support may vary by CPU.
* For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
* The PCIEX8 slot shares bandwidth with the PCIEX16 slot. When the PCIEX8 slot is populated, the PCIEX16 slot operates at up to x8 mode.
* The PCIEX4 slot shares bandwidth with the M2C_SB connector. The PCIEX4 slot becomes unavailable when a device is installed in the M2C_SB connector.
PCI Express 3.0 x16  2 x PCI Express 3.0 x16
PCI Express x16 1 x PCI Express x16
PCI Slots 2 x PCI Slots
Storage Devices
SATA 6Gb/s  6 x SATA 6Gb/s
M.2 1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2242/2280/22110 SSDs:
- AMD Ryzen 5000 Series Processors/AMD Ryzen 3000 Series Processors support SATA and PCIe 4.0 x4/x2 SSDs
- AMD Ryzen 4000 G-Series Processors/AMD Ryzen 3000 G-Series Processors/AMD Ryzen 2000 Series Processors/AMD Ryzen 2000 G-Series Processors support SATA and PCIe 3.0 x4/x2 SSDs

1 x M.2 connector (M2B_SB), integrated in the Chipset, supporting Socket 3, M key, type 2242/2280/22110 SSDs:
- Supporting PCIe 4.0* /3.0 x4/x2 SSDs
* For AMD Ryzen 5000 Series Processors/AMD Ryzen 3000 Series Processors only.

2 x M.2 connectors (M2C_SB/M2D_SB), integrated in the Chipset, supporting Socket 3, M key, type 2242/2280/22110 SSDs:
- Supporting SATA and PCIe 4.0* /3.0 x4/x2 SSDs
* For AMD Ryzen 5000 Series Processors/AMD Ryzen 3000 Series Processors only.
SATA RAID 0/1/10
Onboard Video
Onboard Video Chipset  Supported only by CPU with integrated graphic
Onboard Audio
Audio Chipset  Realtek ALC1220-VB codec

* The front panel line out jack supports DSD audio.
Audio Channels  7.1 Channels
Onboard LAN
LAN Chipset Intel 2.5GbE LAN chip
Max LAN Speed 10/100/1000/2500Mbps
Wireless LAN Intel Wi-Fi 6E AX210
WIFIa,b,g,n,ac,ax
Bluetooth Bluetooth 5.2
Rear Panel Ports
Back I/O Ports 1 x Q-Flash Plus button
1 x Clear CMOS button
2 x SMA antenna connectors (2T2R)
1 x USB Type-C port, with USB 3.2 Gen 2x2 support
5 x USB 3.2 Gen 2 Type-A ports (red)
2 x USB 3.2 Gen 1 ports
4 x USB 2.0/1.1 ports
1 x RJ-45 port
1 x optical S/PDIF Out connector
5 x audio jacks
USB 3.0  6 x USB 3.0
Internal I/O Connectors
Onboard USB 1 x USB Type-C header, with USB 3.2 Gen 2 support
2 x USB 3.2 Gen 1 headers
2 x USB 2.0/1.1 headers
Other Connectors 1 x CPU fan header
1 x water cooling CPU fan header
4 x system fan headers
4 x system fan/water cooling pump headers
2 x addressable LED strip headers
2 x RGB LED strip headers
1 x CPU cooler LED strip/RGB LED strip header
1 x front panel header
1 x front panel audio header
1 x noise detection header
1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
1 x Thunderbolt add-in card connector
2 x temperature sensor headers
1 x power button
1 x reset button
1 x Clear CMOS jumper
Voltage Measurement Points
Physical Spec
Form Factor ATX
LED Lighting RGB
Dimensions (W x L) 12.0" x 9.6"
Power Pin 1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
image

With upgraded power solution, comprehensive thermal design, and intuitive utility for tweaking, the X570S AORUS MASTER is expertly engineered to reign supreme on the latest AMD Ryzen processor platform. PCIe Gen4 M.2 slot and 20 Gbps USB fully support new gen SSDs and peripherals, while WiFi 6E and 2.5 GbE LAN take network performance to the next level. On top of all that, the X570S AORUS MASTER dazzles with classy PCB design and meticulously crafted heatsinks complemented by awesome onboard RGB lighting.

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Direct Power Design

GIGABYTE X570S Motherboards are equipped with best in class power solution to release the full potential of the latest AMD Ryzen 5000 Series CPUs. The VRM power design includes MOSFETs which identify Vcore and SOC accompanied by digital PWM, premium chokes and high quality capacitors to offer extraordinary stability and precision to the high performance CPU. In addition, Six-layered PCB and comprehensive thermal solution allows enthusiasts to enjoy the extreme overclocking performance without compromise.

GIGABYTE Active OC Tuner

With GIGABYTE's exclusive Active OC Tuner BIOS function, CPU* can work with AMD P.B.O. for gaming and other light workload applications with the highest CPU boost clock, but when the applications require all CPU cores’ horsepower, it automatically switches to the Manual OC mode where it can utilize the high frequency for all the CPU cores.

?Active OC Tuner switches profile based on user scenario automatically ?5% performance increase

* Only available on selected AMD Ryzen processors with P.B.O. function featured.

image

Memory Layout — Daisy Chain Design

With the optimized daisy-chain routing, GIGABYTE X570S motherboards provide a proven speed of up to DDR4-5400+ MHz with high density memory modules*. Optimized daisy-chained routing eliminates the stub effect, pushes the one DIMM per channel in dual channel interleaving mode to hit higher memory frequencies, and provides professional gamers a denser and faster system memory experience.

* Performance may vary in circumstances. Please refer to the QVL list for detail support information.

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Support for DDR4 XMP Up to 5400 MHz and Beyond*

AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 5400 MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.

image

* XMP Profile support may vary depending on memory module.

Single 32GB Support

With populated 4 DIMMs per channel on GIGABYTE X570 motherboards, the maximum memory capacity support is 128GB. For users who always run out of memory capacity, they are able to enjoy more bandwidth now for memory-intensive application such as rendering and video editing.

image

Fins-Array II

Fins-Array II uses brand new louvered stacked fins technology which is usually only used on industrial equipment that needs compact heat exchangers. It has a special secondary fins structure that enhances heat transfer performance.

Louver Directed Flow

Heat flow that goes through fins will enter from the leading edge of the louver and is then directed by other louvers or fins. This louver directed flow can greatly improve heat transfer performance.

image

Fins-Array II

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Traditional Stacked Fins

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Circulation Zone

Because of pressure difference and flow separation, a circulation zone will be formed between louvered fins. This circulation will cause flow to entrain and eject in the vortice form which improves thermal efficiency.

NanoCarbon Coated Fins Array Heatsink

As CPUs get more powerful, VRM modules get hotter under ultra high performance. Being the first adopters among industry using NanoCarbon as coating material to enhance thermal radiation speed up heat dissipation. Nanocarbon is coated onto the heatsink through electrostatic adhesion. The coating material covers the entire finned heatsink with 200µm in thickness. In that way, heat is dissipated more quickly. The tests show 10% cooler with the NanoCarbon coating.

image

Direct-Touch Heatpipe II

With an extra large 8mm heatpipe and made by a new manufacturing process which has narrowed down the gap between the heatpipe and heatsink. The new Direct-Touch Heatpipe II greatly helps to dissipate the heat on MOSFETs.

image

M.2 Thermal Guard III

Continuing the advantages of M.2 Thermal Guard II design which uses the double-sided thermal pads to elevate the height of M.2 heatsink to increase surface area to dissipate heats on M.2 SSDs. M.2 Thermal Guard III is constructed with 2.6X optimized heat dissipation surface to prevent throttling and bottleneck that high-speed/ large capacity of PCIe 4.0 M.2 SSDs may cause, especially under heavy workload.

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GIGABYTE motherboards promise the consistent cooling and high performance for users to avoid throttling from the overheating.

* The result is based on internal lab test for reference only. Real performance may vary. Test conditions are under open case, 25°C ambient temperature, no airflow, and AIO Cooler and the latest Gen4 7000 SSD running IO meter for two hours.

image

Smart Fan 6

Smart Fan 6 contains several unique cooling features that ensure gaming PC maintains its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface.

image

Cooling Features

High Current Support

Each fan headers support PWM and DC fan and Water Cooling Pump, and up to 24W (12V x 2A) with Over-Current Protection

Precision Control

Up to 6 temperature/fan speed control points for precise fan curve

Dual Curve Mode

Slope/Stair dual mode for different user scenario

Fan Stop

Fan can stop completely below users' specified temperature point

image

Smart Fan 6 BIOS UI

1. Improve fan curve UI

We increase control points from 5 to 7 and larger fan speed graph for precise and easier fan curve control.

2. Slope/Stair dual graph mode

Fan curve can be quickly switched with Slope and Stair modes for different user scenarios. Slope is traditional and intuitive linear fan speed curve. With newly added Stair non-linear mode, fan keeps at same speed between specified temperature interval.

3. Manual Input

For advanced users, we provide fan speed manual input for more precise control.

4. EZ Tuning

User can place 4 EZ Tuning points at rough temperature/fan speed, and Smart Fan 6 can quickly generate a fan curve.

5.Fan curve profile

Fan curve profile can be saved in BIOS ROM. Profile will be kept after updating BIOS.

image

Fan Stop

Achieve fan silence. With Fan Stop, map any fan to stop completely when temperatures drop below a specified threshold. Which fan stops, based on readings from which sensor, and at what temperature—all of it can be customized to your liking.

Noise Detection

With the new Noise Detection function, you can monitor noise level of all devices including fans, CPU coolers, graphics card, etc. in real time, and you can determine how fast your fan speed needs to be. Our bundled Noise Detection cable doesn’t include any sound recording function, it simply detects sound pressure while protecting your privacy.

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First adopter of 2.5GbE LAN onboard

2X Faster than ever

  • Adoption of 2.5G LAN provides up to 2.5 GbE network connectivity, with at least 2X faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.
  • Support Multi-Gig (10/100/1000/2500Mbps) RJ-45 Ethernet
Detalles del producto
02146
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GIGABYTE X570S AORUS MASTER AM4 AMD X570 SATA 6Gb/s USB 3.0

GIGABYTE X570S AORUS MASTER AM4 AMD X570 SATA 6Gb/s USB 3.0

Admite procesadores AMD Ryzen™ 5000 Series/ Ryzen™ 4000 G Series/ Ryzen™ 3000 Series/ Ryzen™ 3000 G Series/ Ryzen™ 2000 Series/ Ryzen™ 2000 G Series

DDR4 sin búfer ECC/no ECC de dos canales, 4 DIMM

Active OC Tuner presenta cambio dinámico entre P.B.O. y configuración manual de OC

Solución de VRM digital de Infineon directa de 14+2 fases con etapa de potencia de 70 A

Solución térmica avanzada con Fins-Array II, Direct Touch Heatpipe II, M.2 Thermal Guard III y Thermal Backplate

WiFi Intel® 6E 802.11ax y BT 5.2

Quad NVMe PCIe 4.0/3.0 x4 M.2 ultrarrápido con protectores térmicos

LAN ultrarrápida Intel® 2.5GbE 

SuperSpeed USB 3.2 Gen 2x2 TYPE-C® ofrece velocidades de transferencia de hasta 20 Gb/s

Smart Fan 6 

RGB FUSION 2.0 

Q-Flash 

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